Fortibond Trademark Details

This mark is alive with a status of First Extension - Granted. The last case file activity for this mark occured 7 years ago on Tuesday, June 21, 2016, according to the United State Patent & Trademark Office
Word Mark Fortibond
Status Alive 730 — First Extension - Granted

Current Owner

Alpha Assembly Solutions Inc. of Providence, RI

View all trademarks for Alpha Assembly Solutions Inc.
Other Trademarks for Alpha Assembly Solutions Inc.

Previous Owners

Fry's Metals Inc of Jersey City, NJ

View all trademarks for Fry's Metals Inc
Other Trademarks for Fry's Metals Inc
Serial Number 85837492
Status Date Tuesday, June 21, 2016
Filing Date Tuesday, June 21, 2016
Attorney Midge M. Hyman

Correspondent

MIDGE M. HYMAN
Cowan, Liebowitz & Latman, P.C.
114 West 47th Street
New York NY 10036

Case File Statements

Goods & Services Printable pastes for wafer bonding; Printable, dispensable or pin transferable pastes for attachment of semiconductor die either with flip chip wafer bumping or wire bonded type, onto a variety of substrates, and hermetic/near hermetic packaging; printable pastes for attachment of semiconductor packages of various types onto a variety of substrates; printable or dispensable or jettable pastes for production of electrical and thermal interconnect lines and patterns circuitry, pads; Printable pastes for via-fill applications; all used in the semiconductor and electronics industries to form an electrically and/or thermally conductive permanent bond between two surfaces as well as to form an electrical and/or thermal interconnect line and to create a reflective layer underneath or around the semiconductor device
Goods & Services Printable or dispensable or jettable inks composed of silver powder mixed with epoxy material all used in the semiconductor and electronics industries to form an electrically and/or thermally conductive permanent bond between two surfaces as well as to form an electrical and/or thermal interconnect line and to create a reflective layer underneath or around the semiconductor device; pastes for reflective layer printing or transfer composed of silver powder mixed with epoxy material
Goods & Services Transferable semi-finished films for wafer-to-wafer bonding, attachment of semiconductor die either flip chip or wire bonded, onto a variety of substrates, and hermetic/near hermetic packaging; semi-finished films for reflective layer printing or transfer; all used in the semiconductor and electronics industries to form an electrically and/or thermally conductive permanent bond between two surfaces as well as to form an electrical and/or thermal interconnect line and to create a reflective layer underneath or around the semiconductor device

Classifications

International Class Codes
001 — Class 1 includes mainly chemical products used in industry, science and agriculture, including those which go to the making of products belonging to other trademark classes. Examples include compost, salt for preserving non-foodstuffs, and certain additives for the food industry.
U.S. Class Codes 001, 005, 006, 010, 026, 046
Status 6 — Active
Status Date Wednesday, February 6, 2013
Primary Code 001
International Class Codes
002 — Class 2 includes mainly paints, colorants and preparations used for the protection against corrosion. Examples include paints, industrial varnishes and lacquers, dyes for clothing, food and beverage colorants.
U.S. Class Codes 006, 011, 016
Status 6 — Active
Status Date Friday, August 8, 2014
Primary Code 002
International Class Codes
017 — Class 17 includes mainly electrical, thermal and acoustic insulating materials and plastics, being for use in manufacture in the form of sheets, blocks and rods.
U.S. Class Codes 001, 005, 012, 013, 035, 050
Status 6 — Active
Status Date Friday, August 8, 2014
Primary Code 017

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