Image Trademark of I3 Electronics, Inc. Trademark Details
Status | Dead 602 — Abandoned-Failure to Respond or Late Response |
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Previous Owners
Endicott Interconnect Technologies, Inc. of Endicott, NY
View all trademarks for Endicott Interconnect Technologies, Inc.Serial Number | 85656675 |
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Status Date | Wednesday, December 18, 2013 |
Filing Date | Wednesday, December 18, 2013 |
Attorney | Mark Levy |
Correspondent
MARK LEVY
HINMAN, HOWARD & KATTELL, LLP
80 EXCHANGE ST STE 700
BINGHAMTON, NY 13901-3490
HINMAN, HOWARD & KATTELL, LLP
80 EXCHANGE ST STE 700
BINGHAMTON, NY 13901-3490
Case File Statements
Indication of Colors | Color is not claimed as a feature of the mark. |
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Disclaimer with Predetermined Text | "Interconnect" |
Description of Mark | The mark consists of two adjacent "linking" shapes, one of a somewhat "E" configuration and the other of a somewhat "U" configuration. |
Goods & Services | Printed circuit boards; organic printed circuit board substrate materials in the nature of multilayer IC boards for use in computer processors and the like; custom testing machines and inspection machines for manufacturing printed circuit boards and other microelectronics; current induced thermal cycling (CITC) testers; field programmable gate array (FPGA)-based high performance computing accelerator platforms; portable electron volt cadmium zinc telluride (eV-CZT) spectrometer engines in the nature of radiation and explosive detectors designed for handheld instruments; fully integrated electron volt cadmium zinc telluride (eV-CZT) detectors/MCA systems comprising sensors and detectors; lab probes for detecting radiation and/or explosive devices, single point extended area radiation detectors; 16-channel testing platforms for pixelated spectroscopy detector designs and geometries; 1-channel, high count rate, electron volt cadmium zinc telluride (eV-CZT) sensor systems comprising sensors and detectors for industrial imaging applications; ultra-low noise charge-sensitive preamplifiers; drilling machines, punching machines, routing machines, trimming machines, doweling machines, imaging machines, laminating machines, plating machines, etching machines, testing machines, and inspection machines for manufacturing printed circuit boards; electronic components for use with printed circuit boards, namely, capacitors, resistors, inductors, coils, diodes, transistors, integrated circuits, chip carriers, connectors, sockets, switches, crystals, relays, jumpers, thermistors, optoelectronics, thermal conductor modules, dual inline packages consisting of capacitors, resistors, diodes and transistors, and card-on-board assemblies; electrical connectors and parts therefor; artwork master films, namely, glass masters for defining circuit patterns on circuitized substrates, namely, printed circuit boards; and computer software for use in designing, developing and manufacturing printed circuit boards and electronic components for use with printed circuit boards, namely, capacitors, resistors, inductors, coils, diodes, transistors, integrated circuits, chip carriers, connectors, sockets, switches, crystals, relays, jumpers, thermistors, optoelectronics, thermal conductor modules, dual inline packages, and card-on-board assemblies; components for use with printed circuit boards, semiconductor substrate and packaging materials in the nature of multilayer IC boards for use in computer processors and the like, automated testing machines and inspection machines for manufacturing printed circuit boards and electronic components for use with printed circuit boards, medical imaging devices, gamma ray detectors and gamma ray spectroscopy systems, and wearable medical diagnostic and therapeutic devices |
Goods & Services | Development and manufacture of printed circuit boards; assembly and testing of printed circuit boards and semiconductors; electronic computer systems integration for high performance computing (HPC), art and design (A and D), automated test equipment (ATE), medical, imaging, telecomm, microwave, and industrial markets; custom manufacturing of organic printed circuit board substrate materials; organic system-in-package and semiconductor substrate fabrication; custom manufacturing of cadmium zinc telluride (CZT) crystal detectors; semiconductor assembly and test services; advanced laboratory and engineering services, namely, reliability engineering, material science, and failure analysis, thermal and mechanical modeling, product qualifications testing, and mechanical and fragility testing; gamma-ray spectroscopy testing, special nuclear material identification, research in the field of health physics, geological research in the nature of site monitoring; gamma-ray spectroscopy testing, and industrial gauging in the nature of calibration of nuclear density gauges; lab spectroscopy testing, non-medical x-ray imaging, detector development activities, namely, detection of radiation and/or explosive devices; liquid level gauging, fill level gauging, and web/thickness gauging, namely, gauge calibration; x-ray inspection of physical features, case inspection of physical features; detector development activities, namely, sensors and detectors used in detecting radiation and/or explosive devices; developing, designing, and manufacturing services for others of printed circuit boards and electronic components for use with printed circuit boards, namely, capacitors, resistors, inductors, coils, diodes, transistors, integrated circuits, chip carriers, connectors, sockets, switches, crystals, relays, jumpers, thermistors, optoelectronics, modules, dual inline packages consisting of capacitors, resistors, diodes and transistors, and card-on-board assemblies; developing, designing and testing for others of printed circuit boards and electronic components for use with printed circuit boards, namely, capacitors, resistors, inductors, coils, diodes, transistors, integrated circuits, chip carriers, connectors, sockets, switches, crystals, relays, jumpers, thermistors, optoelectronics, modules, dual inline packages consisting of capacitors, resistors, diodes and transistors, and card-on-board assemblies; reliability engineering services, thermal and mechanical modeling services for printed circuit boards and components for use with printed circuit boards, semiconductor substrate and packaging materials, and wearable medical diagnostic and therapeutic devices |
Classifications
International Class Codes |
009
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U.S. Class Codes | 021, 023, 026, 036, 038 |
Status | 6 — Active |
Status Date | Thursday, June 28, 2012 |
First Use Anywhere | Wednesday, March 1, 2006 |
First Use In Commerce | Wednesday, March 1, 2006 |
Primary Code | 009 |
International Class Codes |
042
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U.S. Class Codes | 100, 101 |
Status | 6 — Active |
Status Date | Thursday, June 28, 2012 |
First Use Anywhere | Wednesday, March 1, 2006 |
First Use In Commerce | Wednesday, March 1, 2006 |
Primary Code | 042 |
Trademark Timeline
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Mar 01 2006First use anywhere for the mark
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Mar 01 2006First use in commerce for the mark
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Mar 01 2006First use anywhere for the mark
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Mar 01 2006First use in commerce for the mark
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Jun 20 2012Trademark application filed with USPTO
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Jun 28 2012New Application Office Supplied Data Entered In Tram
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Jun 29 2012Notice of Design Search Code Mailed
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Oct 05 2012Assigned To Examiner
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Oct 11 2012Non-Final Action Written
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Oct 12 2012Non-Final Action Mailed
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Apr 10 2013Teas Response To Office Action Received
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Apr 17 2013Assigned To Lie
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Apr 24 2013Teas/email Correspondence Entered
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Apr 24 2013Correspondence Received In Law Office
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May 17 2013Non-Final Action Mailed
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May 17 2013Non-Final Action Written
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Dec 18 2013Abandonment Notice Mailed - Failure To Respond
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Dec 18 2013Abandonment - Failure To Respond Or Late Response
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Mar 04 2015Assignment of Ownership Not Updated Automatically
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Apr 22 2015Automatic Update of Assignment of Ownership