Di Pak the Future of Ceramic Packaging Trademark Details

This mark is dead with a status of Abandoned - No Statement of Use Filed. The last case file activity for this mark occured 23 years ago on Wednesday, August 23, 2000, according to the United State Patent & Trademark Office
Word Mark Di Pak the Future of Ceramic Packaging
Status Dead 606 — Abandoned - No Statement of Use Filed

Current Owner

Dielectric Laboratories, Inc. of Cazenovia, NY

View all trademarks for Dielectric Laboratories, Inc.
Other Trademarks for Dielectric Laboratories, Inc.
Serial Number 75370818
Status Date Wednesday, August 23, 2000
Filing Date Wednesday, August 23, 2000
Attorney Bernhard P Molldrem Jr

Correspondent

BERNHARD P MOLLDREM JR
TRAPANI & MOLLDREM
MONROE BLDG 2ND FL
333 E ONONDAGA ST
SYRACUSE NY 13202

Case File Statements

Disclaimer with Predetermined Text "PAK" and "CERAMIC PACKAGING"
Description of Mark The mark consists of the stylized wording "DI PAK", the phrase "THE FUTURE OF CERAMIC PACKAGING", and the design of a sphere with a stylized letter "D" on the surface.
Goods & Services Ceramic packaging for integrated circuits and electronic devices, namely, transistors, transducers and combinations thereof
Lining/Stippling Statement The lining and the stippling in the drawing indicate shading.
Pseudo Mark Dye Pack

Classifications

International Class Codes
009 — Class 9 consists mostly of instruments used for controlling vehicles (such as ships), scientific research, and all computer programs and software regardless of the recording media such as CD-ROMs, hard drives, downloads, etc.
U.S. Class Codes 021, 023, 026, 036, 038
Status 6 — Active
Status Date Friday, November 28, 1997
Primary Code 009

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