Copper Core CSP Trademark Details
Word Mark | Copper Core Csp |
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Status | Dead 602 — Abandoned-Failure to Respond or Late Response |
Serial Number | 75733700 |
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Status Date | Thursday, April 11, 2002 |
Filing Date | Thursday, April 11, 2002 |
Attorney | Randy W Tung |
Correspondent
RANDY W TUNG
TUNG & ASSOCIATES
838 W LONG LAKE RD SUITE 120
BLOOMFIELD HILLS MI 48302
TUNG & ASSOCIATES
838 W LONG LAKE RD SUITE 120
BLOOMFIELD HILLS MI 48302
Case File Statements
Goods & Services | Electronic Components, Namely, Solder Bumped Semiconductor Silicon Chips and Wafers; Solder Bumped Electronic Substrates for Use in Further Manufacture of Electronics; and Solder Bumped Electrical Circuit Boards |
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Classifications
International Class Codes |
009
|
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U.S. Class Codes | 021, 023, 026, 036, 038 |
Status | 6 — Active |
Status Date | Thursday, September 9, 1999 |
First Use Anywhere | Tuesday, June 22, 1999 |
Primary Code | 009 |
Trademark Timeline
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Jun 22 1999Trademark application filed with USPTO
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Jun 22 1999First use anywhere for the mark
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Nov 16 1999Assigned To Examiner
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Dec 03 1999Non-Final Action Mailed
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May 26 2000Correspondence Received In Law Office
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Sep 21 2000Non-Final Action Mailed
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Mar 15 2001Use Amendment Filed
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Jun 18 2001Amendment To Use Processing Complete
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Aug 24 2001Disapproval - Amendment To Use Mailed
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Apr 11 2002Abandonment - Failure To Respond Or Late Response