Cmplicity Trademark Details
Word Mark | Cmplicity |
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Status | Dead 606 — Abandoned - No Statement of Use Filed |
Current Owner
Advanced Technology Materials, Inc. of Danbury, CT
View all trademarks for Advanced Technology Materials, Inc.Serial Number | 77175261 |
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Status Date | Monday, December 28, 2009 |
Filing Date | Monday, December 28, 2009 |
Attorney | Steven J. Hultquist |
Correspondent
STEVEN J. HULTQUIST
INTELLECTUAL PROPERTY/TECHNOLOGY LAW
PO BOX 14329
RESEARCH TRIANGLE PARK, NC 27709-4329
INTELLECTUAL PROPERTY/TECHNOLOGY LAW
PO BOX 14329
RESEARCH TRIANGLE PARK, NC 27709-4329
Case File Statements
Goods & Services | Chemicals for use in chemical mechanical polishing and planarization processes in the manufacture of semiconductor and microelectronic products |
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Goods & Services | Chemical mechanical polishing and planarization preparations for use in chemical mechanical polishing and planarization processes in the manufacture of semiconductor and microelectronic products |
Goods & Services | Process equipment for coupling to semiconductor manufacturing machines and semiconductor wafer processing equipment, namely, metal fluid storage tanks for holding chemical mechanical polishing and planarization compositions, and for holding post-chemical mechanical polishing and planarization cleaning compositions, for machines performing chemical mechanical polishing and planarization processes and for machines performing post-chemical mechanical polishing and planarization processes in the manufacture of semiconductor and microelectronic products |
Goods & Services | Process equipment for coupling to semiconductor manufacturing machines and semiconductor wafer processing equipment, namely, mixing machines for blending, mixing and delivering chemicals and chemical mechanical polishing and planarization compositions to machines performing chemical mechanical polishing and planarization processes in the manufacture of semiconductor and microelectronic products; and mixing machines for blending, mixing, and delivering chemicals and post-chemical mechanical polishing and planarization cleaning compositions to machines performing post-chemical mechanical polishing and planarization processes in the manufacture of semiconductor and microelectronic products |
Goods & Services | Process equipment for coupling to semiconductor manufacturing machines and semiconductor wafer processing equipment, namely, dispensers for delivering metered or measured amounts of chemical mechanical polishing and planarization compositions and post-chemical mechanical polishing and planarization cleaning compositions to machines performing chemical mechanical polishing and planarization processes and machines performing post-chemical mechanical polishing and planarization processes in the manufacture of semiconductor and microelectronic products |
Goods & Services | Process equipment for coupling to semiconductor manufacturing machines and semiconductor wafer processing equipment, namely, plastic fluid storage tanks for holding chemical mechanical polishing and planarization compositions, and for holding post-chemical mechanical polishing and planarization cleaning compositions, for machines performing chemical mechanical polishing and planarization processes and for machines performing post-chemical mechanical polishing and planarization processes in the manufacture of semiconductor and microelectronic products |
Pseudo Mark | Simplicity |
Classifications
International Class Codes |
001
|
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U.S. Class Codes | 001, 005, 006, 010, 026, 046 |
Status | 6 — Active |
Status Date | Friday, May 11, 2007 |
Primary Code | 001 |
International Class Codes |
003
|
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U.S. Class Codes | 001, 004, 006, 050, 051, 052 |
Status | 6 — Active |
Status Date | Friday, May 11, 2007 |
Primary Code | 003 |
International Class Codes |
006
|
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U.S. Class Codes | 002, 012, 013, 014, 023, 025, 050 |
Status | 6 — Active |
Status Date | Wednesday, July 23, 2008 |
Primary Code | 006 |
International Class Codes |
007
|
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U.S. Class Codes | 013, 019, 021, 023, 031, 034, 035 |
Status | 6 — Active |
Status Date | Wednesday, July 23, 2008 |
Primary Code | 007 |
International Class Codes |
009
|
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U.S. Class Codes | 021, 023, 026, 036, 038 |
Status | 6 — Active |
Status Date | Friday, May 11, 2007 |
Primary Code | 009 |
International Class Codes |
020
|
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U.S. Class Codes | 002, 013, 022, 025, 032, 050 |
Status | 6 — Active |
Status Date | Wednesday, July 23, 2008 |
Primary Code | 020 |
Trademark Timeline
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May 08 2007Trademark application filed with USPTO
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May 11 2007New Application Entered In Tram
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May 12 2007Notice of Pseudo Mark Mailed
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Jun 29 2007Assigned To Examiner
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Jul 05 2007Notification of Non-Final Action E-Mailed
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Jul 05 2007Non-Final Action E-Mailed
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Jul 05 2007Non-Final Action Written
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Oct 07 2007International filing request made
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Oct 08 2007New Application For Ir Received
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Oct 08 2007Automatically Certified
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Oct 08 2007Ir Certified and Sent To Ib
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Nov 16 2007Irregularity Notice Received From Ib
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Dec 30 2007Correspondence Received In Law Office
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Dec 30 2007Teas Response To Office Action Received
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Dec 31 2007Teas/email Correspondence Entered
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Jan 22 2008Irregularity Response Received From Applicant
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Jan 24 2008Response To Irregularity Reviewed and Accepted
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Jan 24 2008Irregularity Response Sent To Ib
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Jan 25 2008Notification of Final Refusal Emailed
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Jan 25 2008Final Refusal E-Mailed
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Jan 25 2008Final Refusal Written
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Jul 10 2008Application For Ir Registered By Ib
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Jul 23 2008Teas/email Correspondence Entered
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Jul 23 2008Correspondence Received In Law Office
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Jul 23 2008Teas Request For Reconsideration Received
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Jul 29 2008Assigned To Lie
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Jul 29 2008Approved For Pub - Principal Register
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Jul 30 2008Law Office Publication Review Completed
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Aug 13 2008Notice of Publication
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Sep 02 2008Published For Opposition
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Nov 25 2008Noa Mailed - Sou Required From Applicant
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May 25 2009Extension 1 Filed
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May 26 2009Teas Extension Received
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Jun 12 2009Extension 1 Granted
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Jun 12 2009Case Assigned To Intent To Use Paralegal
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Dec 28 2009Abandonment Notice Mailed - No Use Statement Filed
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Dec 28 2009Abandonment - No Use Statement Filed
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Jun 28 2010Total Ceasing of Effect To Be Processed
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Jul 14 2010Ceasing of Effect Processed
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Jul 14 2010Total Ceasing of Effect Notice Sent To Ib
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Oct 16 2010Total Ceasing of Effect Processed By Ib
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Oct 16 2010International Registration Cancelled By Ib