Alpha-Fry Technologies Trademark Details
Word Mark | Alpha-Fry Technologies |
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Status | Dead Registered 710 — Cancelled - Section 8 |
Serial Number | 76057743 |
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Registration Number | 3029558 |
Status Date | Friday, July 20, 2012 |
Filing Date | Friday, July 20, 2012 |
Registration Date | Tuesday, December 13, 2005 |
Attorney | William M. Borchard |
Correspondent
WILLIAM M. BORCHARD
COWAN, LIEBOWITZ & LATMAN, P.C.
1133 AVENUE OF THE AMERICAS
NEW YORK, NEW YORK 10036-6799
COWAN, LIEBOWITZ & LATMAN, P.C.
1133 AVENUE OF THE AMERICAS
NEW YORK, NEW YORK 10036-6799
Case File Statements
Disclaimer with Predetermined Text | "Technologies" |
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Goods & Services | Chemicals for Use in the Manufacture and Assembly of Printed Circuits, Electronic Components and Semiconductor Packages; Chemical Compounds, Namely, Resin Coatings Used as Temporary Solder Masks to Prevent the Adherence of Solder to Base Metal for Use in the Printed Circuit Board Industry; Thermoplastic Paste Adhesives for Use in the Manufacture of Electronic Assemblies; Soldering Chemicals, Namely, Aqueous Machine Descalers for Use in the Printed Circuit Board Industry; Solder Chemicals and Antioxidants for Use with Solder; Chemical Preparations in the Nature of Rust Inhibitors; Soldering Flux; Water Soluble Soldering Flux; Low Solids Solder Flux; Soldering Flux, Zinc Chloride Type; Solder Chemicals and Antioxidants for Use with Solder; Fluxes Used for Soldering Electronic Circuits, Which DO Not Require Cleaning After Said Use; Oxidation Chemicals for Protecting the Surface to Which They Are Applied for Use in Connection with Solder; Silver/Glass Die Attach Material Adhesives for Use in Silicon Chip Binding; |
Goods & Services | Organic Solvents for Cleaning and Degreasing Printed Circuit Boards; Soldering and Printed Circuit Chemicals, Namely, Alkali Cleaners, Degreasing Solvents, Flux Remover, Metal Cleaner, Paint Strippers and Varnish Remover, Wire Stripping Preparation for Removing Insulation from Metal, Silk Screen Ink Remover, Solder Resist Removing Preparation; Solvent and Aqueous Cleaners to Remove Residues and Contaminants Before and After Soldering; Chemical Cleaner and Rosin Flux Remover for Use in Rosin Mildly Activated Paste Applications, Namely, Cleaning Compound for Solder Plated Printed Circuits |
Goods & Services | Tin and Lead Eutectic Solder; Water Soluble Organic Flux Cored Solder Wire; Coated Metal Strip; Solders Composed Primarily of Lead and Tin; Dispenser Filled with Wire Solder; Bar, Wire and Core Solder; Laser Cut Metal Stencils for Use in the Assembly of Electronic Components; Solder Metal Alloy That Is Treated to Inhibit Dross Formation and Increase Fluidity for Use in Soldering Applications; Pastes Containing Metal Powder for Use in Copper Brazing; Flux Cored Wire Solder for Use in the Electronics Industry |
Classifications
International Class Codes |
001
|
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U.S. Class Codes | 001, 005, 006, 010, 026, 046 |
Status | 2 — Sec. 8 – Entire Registration |
Status Date | Friday, July 20, 2012 |
First Use Anywhere | Thursday, January 1, 1998 |
First Use In Commerce | Thursday, January 1, 1998 |
Primary Code | 001 |
International Class Codes |
003
|
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U.S. Class Codes | 001, 004, 006, 050, 051, 052 |
Status | 2 — Sec. 8 – Entire Registration |
Status Date | Friday, July 20, 2012 |
First Use Anywhere | Thursday, January 1, 1998 |
First Use In Commerce | Thursday, January 1, 1998 |
Primary Code | 003 |
International Class Codes |
006
|
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U.S. Class Codes | 002, 012, 013, 014, 023, 025, 050 |
Status | 2 — Sec. 8 – Entire Registration |
Status Date | Friday, July 20, 2012 |
First Use Anywhere | Thursday, January 1, 1998 |
First Use In Commerce | Thursday, January 1, 1998 |
Primary Code | 006 |
Trademark Timeline
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Jan 01 1998First use anywhere for the mark
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Jan 01 1998First use in commerce for the mark
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Jan 01 1998First use anywhere for the mark
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Jan 01 1998First use in commerce for the mark
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Jan 01 1998First use anywhere for the mark
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Jan 01 1998First use in commerce for the mark
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May 25 2000Trademark application filed with USPTO
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Oct 20 2000Assigned To Examiner
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Nov 01 2000Assigned To Examiner
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Nov 15 2000Assigned To Examiner
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Nov 20 2000Non-Final Action Mailed
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May 21 2001Correspondence Received In Law Office
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Nov 19 2001Examiners Amendment Mailed
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Nov 21 2001Approved For Pub - Principal Register
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May 15 2002Notice of Publication
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Jun 04 2002Published For Opposition
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Aug 27 2002Noa Mailed - Sou Required From Applicant
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Feb 20 2003Extension 1 Granted
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Feb 20 2003Extension 1 Filed
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Feb 25 2003Paper Received
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Aug 11 2003Extension 2 Granted
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Aug 11 2003Extension 2 Filed
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Aug 11 2003Paper Received
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Feb 23 2004Extension 3 Filed
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Feb 23 2004Teas Extension Received
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Mar 02 2004Extension 3 Granted
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Jul 22 2004Teas Extension Received
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Jul 29 2004Case File In Ticrs
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Aug 22 2004Extension 4 Filed
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Oct 28 2004Extension 4 Granted
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Jan 06 2005Extension 5 Filed
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Jan 06 2005Teas Extension Received
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Jan 24 2005Extension 5 Granted
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Aug 26 2005Use Amendment Filed
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Aug 30 2005Paper Received
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Sep 13 2005Statement of Use Processing Complete
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Oct 25 2005Allowed Principal Register - Sou Accepted
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Oct 28 2005Assigned To Lie
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Nov 01 2005Law Office Registration Review Completed
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Dec 13 2005Registered-Principal Register
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Dec 13 2005Trademark officially registered with the USPTO
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Jul 20 2012Cancelled Sec. 8 (6-Yr)