Z-Bond Trademark Details

Z-Bond was registered on Tuesday, November 28, 2006 and is currently owned by Endicott Interconnect Technologies, Inc. under the registration number 3177744 . This mark is dead with a status of Cancelled - Section 8. The last case file activity for this mark occured 11 years ago on Friday, July 5, 2013, according to the United State Patent & Trademark Office
Word Mark Z-Bond
Status Dead Registered 710 — Cancelled - Section 8

Current Owner

Endicott Interconnect Technologies, Inc. of Endicott, NY

View all trademarks for Endicott Interconnect Technologies, Inc.
Other Trademarks for Endicott Interconnect Technologies, Inc.

Previous Owners

II-VI Incorporated of San Diego, CA

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Other Trademarks for II-VI Incorporated

Ev Products, Inc. of Saxonburg, PA

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Serial Number 78363151
Registration Number 3177744
Status Date Friday, July 5, 2013
Filing Date Friday, July 5, 2013
Registration Date Tuesday, November 28, 2006
Attorney William H. Logsdon, Registration No. 22,132

Correspondent

William H. Logsdon, Registration No. 22,
Webb Ziesenheim Logsdon Orkin & Hanson,
700 Koppers Building 436 Seventh Avenue
Pittsburgh, PA 15219-1818

Case File Statements

Goods & Services Epoxy resins for radiation detectors

Classifications

International Class Codes
001 — Class 1 includes mainly chemical products used in industry, science and agriculture, including those which go to the making of products belonging to other trademark classes. Examples include compost, salt for preserving non-foodstuffs, and certain additives for the food industry.
U.S. Class Codes 001, 005, 006, 010, 026, 046
Status 2 — Sec. 8 – Entire Registration
Status Date Friday, July 5, 2013
First Use Anywhere Saturday, July 31, 2004
First Use In Commerce Saturday, July 31, 2004
Primary Code 001

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